THE PROBLEM

When compute accelerates, everything else must too.

As AI chips reach unprecedented speeds, they push more data, more power, and more heat through the hardware around them. Every layer of the system must evolve to keep pace.But one critical component is falling behind: the resin inside printed circuit boards and semiconductor substrates. At today’s speeds, it is becoming a fundamental bottleneck to performance.

Our materials have industry-leading performances in key areas that matter including high thermal stability & ultra low dielectric losses.Beyond performance, our materials have additional benefits that can help manufacturers and OEMs reduce costs, simplify processing, meet regulatory concerns, and minimize supply chain risks to enable production scaling faster and with greater confidence.

WHO WE ARE

Advanced materials, naturally engineered.

Renesin is the result of more than a decade of patented research spun out of collaborations between the US Department of War and other leading research institutions.Originally purposed for rugged use in combat vehicles, these resins were coincidentally found to have the exceptional electrical properties needed for high-speed advanced PCBs and substrates.Our mission is to bring these breakthrough materials to the world’s most advanced technologies and transform how intelligence is powered, connected, and scaled.

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